MOU promotes mutual collaboration to advance ICT and electronics engineering communities
Tampa, Florida, 19 April 2018—BICSI, the association advancing the information and communications technology (ICT) community, has signed a Memorandum of Understanding (MOU) with The Electronics Engineers of the Philippines Foundation, Inc. (IECEP Foundation). The purpose of the MOU is to help foster the growth and advancement of the ICT and electronics engineering communities globally. The MOU demonstrates the commitment of both IECEP Foundation and BICSI to further these
goals through collaboration and the sharing of substantial expertise including but not limited to events, education, marketing and standards development.
“With the global convergence of engineering and infrastructure communities to support technology growth and innovation, this is a great time for us to collaborate with our esteemed colleagues at IECEP Foundation,” said BICSI President Jeffrey Beavers, RCDD, OSP, CFHP. “We look forward to the synergy this creates as we prepare the ICT
workforce for vast global expansion.”
IECEP Foundation President Romulo R. Agatep, PECE, APEC/ASEAN Engineer, said “We are pleased with our longstanding relationship with BICSI. We look forward to this opportunity to provide even greater services to our members in the Philippines and around the world. By adapting BICSI standards and offering BICSI education and
training programs, our collaboration will provide unprecedented opportunities for our members to grow their careers. We are especially interested in encouraging our members to achieve BICSI credentials to be globally competitive.”
The IECEP FOUNDATION was organized in March 23, 1999 by the Institute of Electronics and Communications Engineers of the Philippines, Inc., (IECEP), now known as the Institute of Electronics Engineers of the Philippines, Inc., (IECEP) to assist IECEP and its members, including the government and other interested parties in their effort to promote electronics and telecommunications science and technology.